Superconducting bonds for thin film devices
US5139192A · kind A · utility
89Cited by
4References
26Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 3, 1992 |
| Grant date | Aug 18, 1992 |
| Priority date | — |
| Expiry date | Mar 3, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S505/927
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of bonding a superconductive ribbon lead to a superconductive bonding pad connected to superconducting circuitry. The thin ribbon is first coated with a fresh layer of the same material from which it is made and then a very thin layer of a noble metal is applied over that fresh layer. The bonding pad is also prepared with a very thin layer of the noble metal. Those coated surfaces are placed in facing contact and ultrasonically bonded.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.