Fluxless resoldering system and fluxless soldering process
US5139193A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jun 4, 1990 |
| Grant date | Aug 18, 1992 |
| Priority date | — |
| Expiry date | Jun 4, 2010 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K1/012
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A fluxless reflow soldering processing and system having a reactive inert gas control arrangement coupled to a conventional reflow soldering head for enabling solder to wet metallic surfaces for joining purposes. The gas control arrangement includes a set of gas regulating valves and heat exchange units for supplying selected quantities of inert gases under pressure at various temperatures to a soldering area during the soldering process. The inert gases are employed to clean the soldering area of metal oxides and are used to facilitate the forming of a reliable solder joint by inhibiting the formation of metal oxides and by helping to cool down the solder joint in a substantially uniform manner.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.