Fluxless solder
US5139704A · kind A · utility
4Cited by
6References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 12, 1991 |
| Grant date | Aug 18, 1992 |
| Priority date | — |
| Expiry date | Feb 12, 2011 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K35/262
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A fluxless solder for application to metal surfaces which include contaminants such as metal oxides. The fluxless solder includes a reducing agent which reacts with interfering metal oxides to form essentially inert compounds which require no further cleaning. Reducing agents, such as lithium, calcium, strontium and cesium are disclosed for use in lead-tin solders, in amounts ranging from about 0.5 to 10 atom percent. Various methods for forming the fluxless solder are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.