Patent · US Expired

Method for preparing a latently reactive, pastly molding compound made from dimerized trimethylol propane, a prepolymer and an isocyanate compound

US5140089A · kind A · utility

10Cited by
1References
13Claims
0Family size

Assignee

Inventors

Key dates

Filing dateFeb 1, 1991
Grant dateAug 18, 1992
Priority date
Expiry dateFeb 1, 2011

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T442/696
  • WIPO fieldMacromolecular chemistry, polymers
  • WIPO sectorChemistry

Abstract

A pasty molding compound, which is reactive only above room temperature and is intended for manufacturing temperature-resistant, elasticized duromer molded components, consists of a dimerized trimethylol propane (melting point 109.degree. C., molecular weight 250, OH number 900) and of 1 to 625 parts by weight (per 100 parts of methylene diphenyldiisocyanate) of low-molecular weight and an isocyanate-limited polyesterpolyol-diisocyanate-prepolymer, prepared from polycaprolactone and an isomeric mixture of the toluenediisocyanate. This masterbatch, which has an NCO excess of up to 15% over the equivalent quantity of the free OH components can be fortified with fillers and is moldable at low pressures. Furthermore, its application as an impregnating agent for glass-fiber mats to be molded is provided.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.