Method for preparing a latently reactive, pastly molding compound made from dimerized trimethylol propane, a prepolymer and an isocyanate compound
US5140089A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 1, 1991 |
| Grant date | Aug 18, 1992 |
| Priority date | — |
| Expiry date | Feb 1, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T442/696
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A pasty molding compound, which is reactive only above room temperature and is intended for manufacturing temperature-resistant, elasticized duromer molded components, consists of a dimerized trimethylol propane (melting point 109.degree. C., molecular weight 250, OH number 900) and of 1 to 625 parts by weight (per 100 parts of methylene diphenyldiisocyanate) of low-molecular weight and an isocyanate-limited polyesterpolyol-diisocyanate-prepolymer, prepared from polycaprolactone and an isomeric mixture of the toluenediisocyanate. This masterbatch, which has an NCO excess of up to 15% over the equivalent quantity of the free OH components can be fortified with fillers and is moldable at low pressures. Furthermore, its application as an impregnating agent for glass-fiber mats to be molded is provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.