Direct microcircuit decoupling
US5140496A · kind A · utility
45Cited by
5References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 2, 1991 |
| Grant date | Aug 18, 1992 |
| Priority date | — |
| Expiry date | Jan 2, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A decoupling apparatus for a microcircuit provides for a custom capacitor to be placed directly on the passivated upper surface of the integrated circuit or alternatively to be placed directly under the integrated circuit. In another alternative, multiple standard chip capacitors are placed directly on the passivated upper surface and connected by wire bonds to metal bars also resting on the upper surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.