Water-soluble soldering paste
US5141568A · kind A · utility
7Cited by
12References
39Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 31, 1990 |
| Grant date | Aug 25, 1992 |
| Priority date | — |
| Expiry date | Oct 31, 2010 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K35/3618
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A non-toxic, non-corrosive water-soluble soldering paste comprises at least about 80 wt % of particulate solder and the balance a thixotropic flux base. The flux base has a viscosity of at least about 200,000 cp and comprises (a) a botanical oil, (b) an aqueous emulsion of a thickening agent, such as corn starch or an ethoxylated linear alcohol in water, and (c) an organic acid having at least two carboxylic acid groups, such as citric acid. The paste of the invention produces solder joints of high metallic luster and excellent quality. Clean-up of paste residues is ac complished using only water.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.