Lay-up system
US5141582A · kind A · utility
4Cited by
4References
11Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 12, 1990 |
| Grant date | Aug 25, 1992 |
| Priority date | — |
| Expiry date | Sep 12, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1322
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of producing panels from boards wherein a subassembly of boards is prepared on a conveyor and crowded against indexing pins. The trailing board in this subassembly is then cut lengthwise by a saw, to produce a panel assembly of predetermined width. Adhesive is then applied between contiguous edges of the boards in the panel assembly, and the boards then consolidated into an integral panel.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.