Epoxy resin composition
US5141974A · kind A · utility
8Cited by
5References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 13, 1990 |
| Grant date | Aug 25, 1992 |
| Priority date | — |
| Expiry date | Jun 13, 2010 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L63/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A composition is disclosed which comprises the reaction product of a diglycidyl ether of a 4,4'-dihydroxybiphenyl and a polyhydric phenol having an average of 2.3 to 10 hydroxyl groups per molecule. The described epoxy resin is particularly useful in phenolic-cured electrical encapsulation formulations.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.