Electronic switch assembly
US5142183A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 26, 1991 |
| Grant date | Aug 25, 1992 |
| Priority date | — |
| Expiry date | Aug 26, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/42
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A piezoelectric switch assembly and method of manufacture. A piezoelectric module is provided which is comprised of a carrier disk and a wafer of piezoelectric material disposed thereon, with electrical leads connected thereto. The piezoelectric module is disposed inside a hollow recess formed in a switch plug, with the periphery of the carrier disk supported on a rim thereof. A disk of compressible material is disposed between the body of the plug and the piezoelectric module. The switch plug is inserted into a hollow chamber formed in a switch insert, said switch insert having a pressure receiving front wall. A front member is provided which is formed with an aperture for receiving the switch insert. Pressure on the pressure receiving front wall of the socket causes deformation of the piezoelectric wafer to generate an electrical signal which is received by circuitry attached to the electrical leads to effect one or more preselected switch functions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.