Non-destructive semiconductor wafer probing system using laser pulses to generate and detect millimeter wave signals
US5142224A · kind A · utility
113Cited by
15References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 26, 1991 |
| Grant date | Aug 25, 1992 |
| Priority date | — |
| Expiry date | Apr 26, 2011 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/308
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Electrical devices are characterized by optically triggering an electrical signal onto the device and then optically sampling the electrical signal waveform on the device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.