Ceramic package component having one quarter wavelength spaced conductive grounding vias
US5142352A · kind A · utility
11Cited by
7References
1Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 6, 1990 |
| Grant date | Aug 25, 1992 |
| Priority date | — |
| Expiry date | Jul 6, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A ceramic package component has a base portion and an upstanding enclosing wall on the base portion, the upper surface of the wall being provided with an electrically conductive coating in order to receive a lid sealingly thereon. The electrically conductive coating on the upper surface of the wall is electrically connected to a further conductive coating on the undersurface of the base portion by means of a high density array of conductive vias extending through the wall. The inter via spacing between adjacent vias is preferably less than one quarter of the wavelength of the frequency at which the component is to operate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.