Method for making contact openings in color image sensor passivation layer
US5143855A · kind A · utility
11Cited by
2References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 17, 1991 |
| Grant date | Sep 1, 1992 |
| Priority date | — |
| Expiry date | Jun 17, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F77/331
Abstract
This invention relates to a method for fabricating a color solid-state image sensor which comprises, the steps of: forming an inorganic passivation layer over an array of photosensing elements and their associate bonding patterns; providing a color filter array over the passivation layer; forming a photoresist layer over the color filter array and other exposed areas; forming a pattern in the photoresist such that portions over the bonding pad areas are opened; and removing selective regions of the passivation layer to expose the bonding pads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.