Epoxy resin composition for semiconductor sealing
US5143951A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 25, 1990 |
| Grant date | Sep 1, 1992 |
| Priority date | — |
| Expiry date | Oct 25, 2010 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L83/10
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An epoxy resin composition for semiconductor sealing, comprising as essential components: PA0 (A) an epoxy resin, PA0 (B) a phenolic resin curing agent comprising 30-100% by weight, based on the total amount of the phenolic resin curing agent, of a silicone-modified phenolic resin curing agent obtained by reacting a phenolic resin with at least one of silicone compounds represented by the following formulas [I] and [II] ##STR1## wherein ##STR2## A: --R--COOH, ##STR3## or H, R: a lower alkylene group, PA1 10.ltoreq.N=l+m+n+2.ltoreq.200, PA1 0.ltoreq.m/N.ltoreq.0.1, and 5.ltoreq.N/n.ltoreq.50, PA2 (C) an inorganic filler, and PA2 (D) a curing accelerator.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.