Patent · US Expired

Heat-curable bismaleimide molding compositions

US5143969A · kind A · utility

6Cited by

2References

2Claims

0Family size

Assignee

BASF SE

Inventors

Bernd Reck · Arnstadt, DE
Rita A. Laschober · Ludwigshafen, DE
Dale Gerth · Ludwigshafen, DE
Jack D. Boyd · Westminster, US

Key dates

Filing date	Jun 24, 1991
Grant date	Sep 1, 1992
Priority date	—
Expiry date	Jun 24, 2011

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC08F222/404
WIPO fieldMacromolecular chemistry, polymers
WIPO sectorChemistry

Abstract

Heat-curable bismaleimide resins contain a bismaleimide, an aromatic dialkenyl compound as comonomer and also from 1 to 40% by weight of a monoalkenyl compound, preferably 2-hydroxy-3-allylbiphenyl, as reactive diluent.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.