Heat resistant polyamide film
US5143983A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 6, 1991 |
| Grant date | Sep 1, 1992 |
| Priority date | — |
| Expiry date | Sep 6, 2011 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08J2377/06
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A heat resistant polyamide film which is obtained by melt-extruding into a sheet a polyamide composition of a mixture of a preformed polyamide (A) composed of diaminobutane and adipic acid and a semi-aromatic polyamide (B) composed of a polyamide containing an aromatic dicarboxylic acid and an aliphatic diamine in an amount of at least 80% by weight of the polyamide-constituting components, in a weight ratio of (A):(B)=99.9:0.1 to 30:70, quenching the sheet, then biaxially stretching it at least 2.0.times.2.0 times, followed by heat setting at a temperature of at least 205.degree. C., and which has a heat distortion initiation temperature of at least 130.degree. C.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.