Method of making rigid-flex printed circuit boards
US5144742A · kind A · utility
49Cited by
8References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 27, 1991 |
| Grant date | Sep 8, 1992 |
| Priority date | — |
| Expiry date | Feb 27, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1798
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Rigid-flex printed circuit boards (PCBs) are fabricated by an improved and simplified process to form the PCBs from rigid-flex PCB subassemblies with both rigid and flex sections incorporating suitable insulator materials. The flex sections of the PCB subassemblies are protectively covered by insulating layers formed by deposition of a liquid precursor for the insulator material and curing of the liquid precursor to form the insulating layers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.