Solder precipitating composition
US5145532A · kind A · utility
25Cited by
4References
28Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Sep 14, 1988 |
| Grant date | Sep 8, 1992 |
| Priority date | — |
| Expiry date | Sep 14, 2008 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/125
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A solder precipitating composition comprises a powder of a metal having the highest ionization level among metals constituting a solder alloy to be prepared, and a salt between a carboxylic acid and a remaining metal of the solder alloy. The composition is applied to a surface on which the solder is to be precipitated, and the solder is precipitated, thereby performing soldering.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.