Method of making a flexible circuit member
US5145553A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 6, 1991 |
| Grant date | Sep 8, 1992 |
| Priority date | — |
| Expiry date | May 6, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1572
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of making a flexible circuit member including a stainless steel base member, a dielectric layer (polyimide) on the base member and a conductive circuit (copper) on the dielectric. The circuit member may be first formed as a laminate structure wherein the dielectric polyimide is coated on the stainless steel and appropriately treated (cured). The copper circuitry is then formed utilizing resist application and exposure techniques. Significantly, the copper-containing circuitry and stainless steel base member are simultaneously etched using a cupric chloride etchant solution to effectively remove desired portions of these metallic materials and produce the desired flexible circuit member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.