Stripping method for removing resist from a printed circuit board
US5145717A · kind A · utility
17Cited by
9References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 20, 1990 |
| Grant date | Sep 8, 1992 |
| Priority date | — |
| Expiry date | Jun 20, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/064
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A stripping method is provided to remove processed photoresist images from printed circuit substrates without damage to underlying high density circuitry. A solid particulate blast process is used to remove the resist images wherein the polymeric particles having a Mho hardness in the range from 2.0 to 4.0 are used as the blast media.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.