Vapor reflow type soldering apparatus
US5146694A · kind A · utility
7Cited by
7References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 2, 1990 |
| Grant date | Sep 15, 1992 |
| Priority date | — |
| Expiry date | Oct 2, 2010 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K1/015
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A vapor reflow type soldering apparatus with an upper supply hole of vapor for heating the upper surface of an article to be processed, the position of which is displaced to the downstream side along a direction of delivery with respect to that of a lower supply hole of vapor for heating the lower surface of the article, so that the temperature of the upper surface of the article to be processed can be raised more moderately than that of the lower surface thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.