Patent · US Expired

Interlocking dimple-hinged door blister package

US5147035A · kind A · utility

31Cited by
11References
8Claims
0Family size

Assignee

Inventor

Key dates

Filing dateApr 17, 1991
Grant dateSep 15, 1992
Priority date
Expiry dateApr 17, 2011

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10S206/815
  • WIPO fieldHandling
  • WIPO sectorMechanical engineering

Abstract

A thermoformed reclosable display package is provided having a bubble body, cover independent of the body and hinge through which the cover rotatably attaches to the body. An egress opening for packaged items is formed in the body and is coverable by the hinged cover. A sealing device in the form of a projection-depression are formed in side walls of the blister body and cover for purposes of resecuring the cover onto the body. A pair of opening extension apertures may be cut outwardly along opposite borders of the egress opening. These apertures allow for extraction of product items from within the blister body.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.