Patent · US Expired

Reliable superconducting link for superconducting thin film components with U-shaped end portions

US5148262A · kind A · utility

5Cited by
3References
7Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJul 1, 1991
Grant dateSep 15, 1992
Priority date
Expiry dateJul 1, 2011

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10S505/927
  • WIPO fieldElectrical machinery, apparatus, energy
  • WIPO sectorElectrical engineering

Abstract

A reliable superconducting contact for superconducting thin film components, based on soft superconducting materials, and a method for making the contacts. A wire blank is squeezed to a thin plate and then this plate is cut into slabs used in the bonding. The ends of the slabs are longitudinally cut so that double or multiple parallel joints can be made. The slabs have elastic, bent central portions for absorbing stresses and stiff ends having a U-beam shape joined to the components. The U-beam shape may be formed by the soldering tool used to make the joints. The ribbon-like character, thinness and other features of the bonding slab permit a precise control of the bonding temperature, reduce the strain and bending forces caused by thermal contraction, and prevent the contact from peeling off while cooling the superconducting component to the operational temperature.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.