Method for making printed circuits
US5148355A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 22, 1990 |
| Grant date | Sep 15, 1992 |
| Priority date | — |
| Expiry date | Oct 22, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12014
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Printed circuits are produced by screen printing or the like to deposit conductors, resistors, capacitors and insulators. Crossover connections are made by covering the conducting portions to be crossed with an insulating material that serves as a base for a printed crossing conductor. The equivalent of multilayer boards can be achieved by printing repeated layers of conductors, components and insulators on the same side of the board, or by printing on two sides of a board. Interconnection between adjacent layers can be made as a part of the printing process. A method of making a printed circuit board comprises applying a first and second coating in a desired pattern to a substrate, the substrate (12) being disposed in a different relationship to coating apparatus used in applying a second coating from the relationship in which it is disposed in applying the first coating. Preferably a number of identical boards are printed on a substrate (12) from which they are subsequently separated. The individual boards are positioned such that the same pattern may be applied when the substrate (12) is presented to coating means in any of a number of orientations each separated from the next b…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.