Apparatus and method for detecting missing interconnect material
US5148967A · kind A · utility
16Cited by
4References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 15, 1991 |
| Grant date | Sep 22, 1992 |
| Priority date | — |
| Expiry date | Jul 15, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Apparatus and method for detecting missing interconnect material. The distance traveled by a bonding tool is measured while the interconnect material is being bonded to a site. Unless it exceeds a predetermined threshold, a signal is generated indicating missing interconnect material. A pivoting system associated mating electrical contacts, and a measurement/comparator are advantageously employed to facilitate this measurement.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.