Process for producing a resin bonded magnet structure
US5149477A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 21, 1992 |
| Grant date | Sep 22, 1992 |
| Priority date | — |
| Expiry date | Feb 21, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S264/58
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A process for producing resin bonded magnet structures is disclosed which includes the steps of: (a) adding a solid epoxy resin of at least one epoxy oligomer and a microcapsule which contains at least one liquid epoxy resin to a melt spun powder of a rare earth element-iron alloy to form a granulated intermediate material, wherein the epoxy oligomer has alcoholic hydroxyl groups in the molecular chain thereof and the solid epoxy resin has a softening temperature (Durran's melting point) of 65.degree. C. to 85.degree. C.; (b) mixing the granulated intermediate material with a powdered curing agent and a lubricant to form a compound; (c) forming a green body of a resin bonded magnet by compressing the compound, and then integrating the green body directly with a supporting member; and (d) curing the solid and liquid epoxy resins in the green body by application of heat to form a rigid structure of the resin bonded magnet integrated with the supporting member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.