Radiation-curable adhesive tape
US5149586A · kind A · utility
19Cited by
5References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 21, 1990 |
| Grant date | Sep 22, 1992 |
| Priority date | — |
| Expiry date | Dec 21, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2896
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
There is a radiation-curable adhesive tape comprising a radiation-curable adhesive layer which is formed on a radiation transmitting-substrate. The radiation-curable adhesive layer is composed of an acrylic adhesive and radiation-curable compound having carbon-carbon double bonds. The radiation-curable tape can be used preferably in processing steps for the production of semiconductor wafer, ceramics and glass employing a direct picking-up system.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.