Epoxy resin composition
US5149730A · kind A · utility
10Cited by
8References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 13, 1990 |
| Grant date | Sep 22, 1992 |
| Priority date | — |
| Expiry date | Jun 13, 2010 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L63/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An electrical encapsulation formulation is provided comprising a diglycidyl ether of a 4,4'-dihydroxybiphenyl, a trisphenolic curing agent, a cure accelerator and an inorganic filler. The composition cures rapidly and exhibits excellent resistance to cracking under high-temperature operation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.