Member for use in assembly of integrated circuit elements and a method of testing assembled integrated circuit elements
US5150047A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 17, 1990 |
| Grant date | Sep 22, 1992 |
| Priority date | — |
| Expiry date | Jul 17, 2010 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/31905
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An apparatus for assembly and testing of an IC element having a first section designated for primary functions of the IC element and a second section designated for testing of the IC element, including a substrate made of a film of insulating material and having an IC-mounting portion defining a position of IC element to be assembled a plurality of first leads mounted on the substrate and connected to the first section of the IC element when mounted to the IC-mounting portion, a plurality of second leads connected to the second section of the IC element, a single first test pad for connection of the first leads thereto, second test pads for connection of the respective second leads thereto and circuit for connecting the first leads to at least one of the second leads for testing the IC element through the first and second pads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.