Rapid-curing adhesive formulation for semiconductor devices
US5150195A · kind A · utility
38Cited by
12References
17Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 24, 1990 |
| Grant date | Sep 22, 1992 |
| Priority date | — |
| Expiry date | Oct 24, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A rapid curing adhesive formulation that contains 10-40 wt. % of a cyanate ester vehicle having a cyanate ester, alkylphenol and a metal curing catalyst and 60-90 wt. % of thermally and/or electrically conductive filler. The adhesive formulation has a maximum curing time of 5 minutes, preferably 2 minutes, at 200.degree. C. and is adapted for use in high speed processes for production of bonded semiconductor assemblies.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.