Tool exchange system for hybrid die bonder
US5150530A · kind A · utility
1Cited by
3References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 27, 1991 |
| Grant date | Sep 29, 1992 |
| Priority date | — |
| Expiry date | Feb 27, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S33/01
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A hybrid die bonder has the ability to change tool holders to accommodate different die sizes. The single pick up head is selectively, magnetically, connectable to any of a plurality of tool holders. An electromagnet in the head holds a magnetic tool holder and a sealed air line is established therebetween. Prior to pick up, the head and tool holder have the same orientation so that precision locating structure therebetween will cooperate to establish a precise axis for the tool holder.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.