Method of cutting thin film out and device for practicing same
US5150639A · kind A · utility
2Cited by
6References
9Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Oct 7, 1991 |
| Grant date | Sep 29, 1992 |
| Priority date | — |
| Expiry date | Oct 7, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/108
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method in which a thin continuous film for conveying a base plate put on the film and another thin continuous film stuck to the main surface of the plate are automatically cut out along the contour of the plate, wherein a cutter is moved to one end of each edge of the plate from an optional position distant from the edge and is thereafter moved to the other end of the edge from another optional position distant from the edge, and movement of the cutter is performed with regard to all the edges of the plate sequentially.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.