Solder paste
US5150832A · kind A · utility
22Cited by
4References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 28, 1991 |
| Grant date | Sep 29, 1992 |
| Priority date | — |
| Expiry date | Jun 28, 2011 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K35/3618
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A solder flux that is useful in applications such as surface mounting of components on printed circuit boards has been found. After soldering, the residue from the flux is either removable by water cleaning or requires no cleaning at all. The achievement of these desirable properties is accomplished by employing a solder flux vehicle including a removing agent, a low vapor pressure component, a high temperature component, and a rheological properties promoter.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.