Resin molding apparatus
US5151276A · kind A · utility
22Cited by
4References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 27, 1990 |
| Grant date | Sep 29, 1992 |
| Priority date | — |
| Expiry date | Dec 27, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A resin molding apparatus for molding an insulating resin mold at the peripheral portion of a semiconductor wafer has an upper metallic mold, and a lower metallic mold which clamps the semiconductor wafer with the upper metallic mold. The upper and lower metallic molds form a resin space at the portion corresponding to the peripheral portion of the semiconductor wafer. The contact surfaces of the upper and lower metallic molds, which are in contact with the semiconductor wafer, and the inner surface of the resin space are coated with elastic material which does not adhere to the insulating resin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.