Method of applying metallized contacts to a solar cell
US5151386A · kind A · utility
25Cited by
7References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 1, 1990 |
| Grant date | Sep 29, 1992 |
| Priority date | — |
| Expiry date | Aug 1, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of applying metallized contacts to the surfaces of semiconductor substrates using a conventional pad printing device. Standard screen printing inks diluted 2-30 weight percent with an appropriate solvent have been satisfactorily used to accomplish the method. For certain contact configurations, portions of the surface of the substrate are covered with a Mylar mask during the pad printing process. The method makes it possible to form a metallized contact having a uniform thickness on an uneven substrate surface, e.g., the surface of a silicon substrate produced by the EFG method.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.