Semiconductor integrated circuit device
US5151772A · kind A · utility
5Cited by
11References
32Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Nov 20, 1990 |
| Grant date | Sep 29, 1992 |
| Priority date | — |
| Expiry date | Nov 20, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S257/923
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor integrated circuit device is provided which includes a memory cell array located in a generally central area of a semiconductor substrate with peripheral circuits located at both ends of the semiconductor substrate. A wiring layer is also provided which couples the peripheral circuits to one another. This wiring layer is arranged to have a double-layer structure of first and second aluminum layers which are electrically coupled to one another.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.