Electronic circuit apparatus comprising a structure for sealing an electronic circuit
US5151773A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 28, 1991 |
| Grant date | Sep 29, 1992 |
| Priority date | — |
| Expiry date | Mar 28, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16315
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic circuit apparatus in which electronic circuit components are mounted to multiwiring substrate or the like for use with electronic circuits such as an LSI are sealed airtight by sealing units. The sealing unit is sealed by an upper board designated as an upper board sealing unit and a side board designated as a side board sealing unit, and the shape of the edge on cross section of the side board is convex or circular. Metallization is applied to solder joint portions between a substrate and a side board and between the side board and the upper board, and a predetermined solder joint height is provided by a support post to effect solder joining.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.