Electrostatic chuck
US5151845A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 11, 1991 |
| Grant date | Sep 29, 1992 |
| Priority date | — |
| Expiry date | Oct 11, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T279/23
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electrostatic chuck for electrostatically attracting and holding an object such as a semiconductor wafer includes a base plate, at least two layers each including an electrically insulating film and an electrode attached to a lower surface thereof, the at least two layers being disposed as attractive layers on the base plate, and a voltage applying assembly for selectively applying a voltage to at least one of the electrodes to electrostatically attract the object to the insulating film of an uppermost one of the layers. The insulating films may have different insulation resistances to allow for a wider range of temperature changes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.