Hot gas jet device for installing and removing components with respect to a substrate and improved tip for use therewith
US5152447A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 16, 1992 |
| Grant date | Oct 6, 1992 |
| Priority date | — |
| Expiry date | Jan 16, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3494
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A device for installing or removing a component with respect to a substrate utilizing hot gas jets or other hot gas flow to reflow solder associated with the component. The device includes an improved tip mounted with respect to a hot gas supply, the tip including (a) a manifold member having an inlet bore mountable with respect to the hot gas supply, and one or more manifolds connected to the inlet bore, each manifold having at least one opening in a side thereof, and (b) at least one nozzle member including a sleeve with an opening in the side thereof, and a hollow nozzle connected to the sleeve and having an opening at the distal end thereof, the sleeve being rotatably mountable on the manifold to effect selective engagement of the opening in the sleeve with the opening in the manifold so that, in a first rotated position of the sleeve with respect to the manifold, the opening in the manifold communicates with the opening in the sleeve to effect a hot gas jet passage from the hot gas supply to the nozzle opening via the inlet bore, the manifold, and the nozzle and, in a second rotated position of the sleeve with respect to the manifold, communication between the opening in the m…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.