Thermoplastic molding materials based on toughened polyamide and functionalized polyphenylene ether

US5153266A · kind A · utility

Assignee

• BASF SE

Inventors

• Klaus Muehlbach · Havelsee, DE
• Graham E. McKee · Ludwigshafen, DE
• Ehrenfried Baumgartner · Bad Dürkheim, DE

Key dates

• Filing date: Feb 21, 1990
• Grant date: Oct 6, 1992
• Expiry date: Feb 21, 2010

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10S525/905
• WIPO field: Macromolecular chemistry, polymers
• WIPO sector: Chemistry

Abstract

Thermoplastic molding materials which are free of cyanuric acid or cyanuric acid derivatives contain as essential components, PA1 (A) from 5 to 95% by weight of a toughened polyamide of PA2 a1) from 70 to 98% by weight, based on (A), of a polyamide and PA2 a2) from 2 to 30% by weight, based on (A), of an emulsion polymer whose particles do not have a hard outer shell, and PA1 (B) from 5 to 95% by weight of a functionalized polyphenylene ether.