Cooling structure of a test head for IC tester
US5153815A · kind A · utility
12Cited by
6References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 21, 1990 |
| Grant date | Oct 6, 1992 |
| Priority date | — |
| Expiry date | Dec 21, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20254
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
There is disclosed a cooling structure of a test head for IC tester capable of effectively cooling ICs mounted on printed boards. The ICs can be cooled by providing a hinge between the printed boards disposed around a pipe, retaining cooling plates having a conduit by the hinge and flowing fluid having a large specific heat such as water into the conduit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.