X-ray reduction projection exposure system of reflection type
US5153898A · kind A · utility
112Cited by
11References
71Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 28, 1992 |
| Grant date | Oct 6, 1992 |
| Priority date | — |
| Expiry date | Feb 28, 2012 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/70891
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An X-ray exposure apparatus includes a stage for holding a mask having a pattern for circuit manufacturing, a stage for holding a wafer to be exposed to the pattern of the mask with X-rays, and a reflection reduction imaging system, disposed between the mask stage and the wafer stage, including a reflecting mirror arrangement, containing at least three, but not more than five, reflecting mirrors coated with multi-layer films for receiving X-rays from the mask and directing them to the wafer to expose the wafer to the pattern of the mask with the X-ray in a reduced scale.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.