Process for producing printed wiring boards
US5153987A · kind A · utility
62Cited by
4References
12Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Apr 10, 1989 |
| Grant date | Oct 13, 1992 |
| Priority date | — |
| Expiry date | Apr 10, 2009 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
By using a composite film comprising an additive layer and an insulating layer containing an epoxy resin and a synthetic rubber as major components, printed wiring boards having a higher circuit density and higher reliability can be produced simply and effectively.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.