Wafer carrier
US5154301A · kind A · utility
478Cited by
3References
13Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 12, 1991 |
| Grant date | Oct 13, 1992 |
| Priority date | — |
| Expiry date | Sep 12, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6733
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A moldable plastic, distortion and warp resistant wafer carrier with forked end wall portions that tie into the sidewalls of the carrier. The forked end wall portions from triangular column like supports between an end wall and sidewalls of the carrier such that the carrier maintains structural integrity even when its temperature fluctuates between ambient and 180.degree. C. temperatures in a relatively short time period. The structural integrity of the carrier is further enhanced by the end wall having an integrally formed bend which is disposed at a right angle relative to the forked end wall portions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.