Patent · US Expired

Method for drilling multilayer printed circuit boards

US5154546A · kind A · utility

8Cited by

2References

7Claims

0Family size

Assignee

Siemens Nixdorf Informationssysteme AG · DE

Inventors

Rudolf Neumann · Spaichingen, DE
Wolfgang Mann · Neudrossenfeld, DE
Heinz-Joerg Selbmann · Augsburg, DE

Key dates

Filing date	Oct 11, 1991
Grant date	Oct 13, 1992
Priority date	—
Expiry date	Oct 11, 2011

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T408/3806
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

The invention is directed to a method for drilling multilayer printed circuit boards, and is also directed to a printed circuit board drill for the implementation of this method. When, based on a known measuring procedure, an offset of the interior layers of the printed circuit boards relative to the rated position is identified, the drill spindles must be appropriately adjusted before drilling in order to avoid rejects. This, however, has the disadvantage that respectively only one printed circuit board can be drilled at one time. Contrasting therewith, the invention provides that the seating plate for the printed circuit board of the drill can be designed variable with respect to the drill spindle, so that a plurality of seating plates can now be adjusted independently of one another. As a consequence, the employment of multi-spindle drills becomes possible.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.