Patent · US Expired

Method for bonding or potting substrates

US5154791A · kind A · utility

10Cited by

5References

14Claims

0Family size

Assignee

Thera Patent GmbH & Co. KG Gesellschaft fur industrielle · DE

Inventors

Oswald Gasser · Hanerau-Hademarschen, DE
Erich Wanek · Kaufering, DE
Klaus Ellrich · Herrsching am Ammersee, DE
Rainer Guggenberger · Hanerau-Hademarschen, DE

Key dates

Filing date	Mar 22, 1990
Grant date	Oct 13, 1992
Priority date	—
Expiry date	Mar 22, 2010

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC09J163/00
WIPO fieldBasic materials chemistry
WIPO sectorChemistry

Abstract

A method for bonding or potting substrates by means of cationically polymerizable masses being activated before joining or potting by irradiation with visible light and curing after joining or potting of the substrates without the irradiation being continued is described as well as an apparatus for executing this method. By irradiation with light having a wavelength of from 400 to 600 nm for photo-activation of said masses, a prolonged pot life of said masses without reducing their wetting ability during pot life is obtained such that the masses are unlimitedly applicable for more than 30, preferably more than 100 sec. after exposure is finished. The apparatus according to the invention comprises a source of irradiation which exclusively emits light having a wavelength of >400 nm.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.