Phenolic novolak resins, cured substances therefrom and method for production thereof
US5155202A · kind A · utility
5Cited by
4References
32Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 6, 1991 |
| Grant date | Oct 13, 1992 |
| Priority date | — |
| Expiry date | Feb 6, 2011 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G59/08
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A phenolic novolak resin comprising a compound represented by the general formula [I]: ##STR1## wherein X is H or ##STR2## R is an alkyl group having 1 to 4 carbon atoms, and n is 1 to 10, particularly a phenolic novolak epoxy resin, and material, and a cured substance therefrom, and a process for producing the resin are disclosed. This resin is excellent in heat resistance and in reluctance to absorb water as compared with conventional phenolic resins, and useful in sealing electronic parts, molding, and laminating.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.