Method for selective laser sintering with layerwise cross-scanning
US5155324A · kind A · utility
Inventors
Key dates
| Filing date | Nov 9, 1990 |
| Grant date | Oct 13, 1992 |
| Priority date | — |
| Expiry date | Nov 9, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P10/25
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
An apparatus and method for producing parts by selective laser sintering are disclosed. The disclosed method selectively sinters a first layer of heat-fusible powder by directing a laser beam so that it scans the first layer in a first direction to sinter a first cross-section of the part. A second layer of the heat-fusible powder is then disposed over the first layer, and the next cross-section of the part is selectively sintered by the laser being scanned in a different direction from the first direction, for example in a direction perpendicular to the first direction. The cross-scanning resulting from scanning in different directions provides parts with structural strength which is not dependent upon orientation, with more uniform surfaces and textures, and with reduced distortion. In addition, each of the layers may have its outlined traced prior to the scanning, to further define the edges of the cross-section.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.