Integrated circuit carriers and a method for making engineering changes in said carriers
US5155577A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 7, 1991 |
| Grant date | Oct 13, 1992 |
| Priority date | — |
| Expiry date | Jan 7, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit carrier comprising a modular substrate having an upper surface, a multitude of electrically conducting device terminals on the upper surface of the substrate, a multitude of electrically conducting engineering change pads also on the upper surface of the substrate, and an engineering change network to form a unique electrical connection between each of an arbitrary subset of the device terminals and each of an arbitrary subset of the engineering change pads. The engineering change network includes a multitude of connecting pads, and a multitude of first, second, and third conductive leads or wires, and each of the connecting pads includes first and second spaced apart sections.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.