Process for the production of a solder coating on metallized materials

US5156322A · kind A · utility

Assignee

• Hoechst Ceramtec AG · DE

Inventors

• Tha Do-Thoi · Westerburg, DE
• Klaus Popp · Nürnberg, DE

Key dates

• Filing date: Jun 11, 1991
• Grant date: Oct 20, 1992
• Expiry date: Jun 11, 2011

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T428/12882
• WIPO field: Audio-visual technology
• WIPO sector: Electrical engineering

Abstract

A solder coating is applied to a metallized ceramic part in that at least two layers, in each case composed of nickel, copper, silver, zinc or tin, are applied chemically or galvanically. Under the soldering conditions molten solder metal forms on these layers. Useful layers for hard solders are those which are in each case composed of Ni, Cu or Ag. For example, a layer of nickel, copper or silver, with a layer thickness of at least 0.5 .mu.m, can be first applied to the metallized ceramic part, followed by at least one further layer of nickel, copper or silver with a layer thickness of 10-105 .mu.m, until a total layer thickness of 15-300 .mu.m is obtained.