Vapor reflow type soldering method and apparatus therefor
US5156325A · kind A · utility
9Cited by
0References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 20, 1990 |
| Grant date | Oct 20, 1992 |
| Priority date | — |
| Expiry date | Dec 20, 2010 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K1/015
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
In case of suspending an apparatus upon the completion of soldering operation, from not smaller than 50% to less than 95% of a thermomedium in a reflow section is transferred to a filtering tank and the remaining thermomedium is made to pass through a water separator in advance of suspending the apparatus, so that water in the thermomedium is removed. This water removing operation makes it possible to prevent the corrosion of the reflow section and the deterioration of the thermomedium. Additionally, a method is disclosed for preventing water to be mixed with the thermomedium by warming the reflow section before operation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.